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  • MediaTek Helio G70 SoC with HyperEngine game technology launched, will power mid-range phones
  • “The MediaTek Helio G70 is believed to power Xiaomi’s upcoming Redmi 9 smartphone”

    MediaTek has quietly introduced its latest Helio G-series SoC, called Helio G70. The launch of the Helio G70 was expected, especially after 91mobiles reported that the chipset would power the upcoming Xiaomi Redmi 9 smartphone. Helio G70 is a toned-down version of last year’s MediaTek G90 series SoCs, which powers smartphones such as the Redmi Note 8 Pro. As part of the newly-minted G-series, the Helio G70 SoC is also a gaming-centric chipset that aims to deliver fast and smooth gaming experience even in affordable phones. It ships with the same MediaTek Hyper Engine game technology for an improved game performance as its sibling Helio G90. In addition to that, the Helio G70 touts 64-bit octa-cores, additional multi-camera photography with secure ISP, an integrated voice on wakeup, and more.

    The MediaTek Helio G70 SoC comes with HyperEngine Game technology.

    MediaTek Helio G70 specifications

    MediaTek Helio G70 SoC incorporates a pair of powerful Arm Cortex-A75 CPUs operating up to 2GHz, plus six Cortex-A55 processors in a single, octa-core cluster. It is said to support large L3 cache for improved performance and up to 8GB of fast LPDDR4X memory. The chipset is aided by proprietor’s CorePilot Arm Mali-G52 class graphics processor that operates up to 820MHz to take care of high-end gaming. The Helio G70’s HyperEngine game technology ensures that “you get fast and smooth action in your favourite games, through intelligent networking and resource management,” according to MediaTek.

    As for the photography, the chipset supports up to 48MP single camera or up to 16MP + 16MP dual camera units with 30 frames per second video recording support. It’s also bundled with camera features such as AI Face ID (Face Unlock), AI Smart Photo Album, Single-Cam/Dual-Cam Bokeh, EIS, Rolling Shutter Compensation (RSC) engine, MEMA 3DNR, and Multi-Frame Noise reduction. The chipset has a secure ISP design for security.

    Talking about the integrated Voice on Wakeup (VoW), it’s expected to optimise platform size and minimise power use for voice assistant services. Other highlights include maximum display resolution of 1,080 x 2,520 pixels, up to 8GB memory size, eMMC 5.1 storage, and standard connectivity options such as Bluetooth 5.0, Dual 4G VoLTE, and Wi-Fi 5.



    from 91mobiles.com https://ift.tt/36NBARr
    via gqrds

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